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Investor Summit FinTech Deal Day Roadshow: Hong Kong

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Wing Hang Bank Building

Level 18

161 Queen’s Road Central

Hong Kong

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Investor Summit FinTech Deal Day Roadshow

Hong Kong, 15th August 2018


As part of the Singapore Fintech Festival (SFF) 2018, an Investor Summit FinTech Deal Day on 14 November 2018 will bring together the best of the best in terms of innovations, giving investors an opportunity to be part of the FinTech ecosystem.

Powered by EY, FinTech Deal Day is targeted at promising FinTechs and interested investors. A personalized matchmaking process will help create the best fit for both parties in the lead-up to the FinTech Deal Day.


Join us at this roadshow to find out more about how the matchmaking process works in the best of both ways for investors and FinTechs.


Event Agenda:

4:00pm - 4.30pm: Registration

4:30pm - 4.35pm: Welcome address by OCBC

4:35pm - 4.45pm: The Open Vault at OCBC: Work with us

4:45pm - 5.05pm: Opportunities and challenges for banks in Hong Kong

5:05pm - 5.15pm: About FinTech Deal Day

5:15pm - 5.25pm: Startup Pitch

5:25pm - 5.30pm: Closing remarks by OCBC

5:30pm - 6.00pm: Networking & refreshments


Visit www.ey.com/sg/investorsummit2018 or contact us at fintechasean@sg.ey.com for more information!




This event is jointly organized by EY and The Open Vault.

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Date and Time

Location

Wing Hang Bank Building

Level 18

161 Queen’s Road Central

Hong Kong

View Map

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