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WEBINAR SERIES: SOLVE HEAT TRANSFER CHALLENGES IN ELECTRONIC BOX, THE SMART...
Fri 18 November 2016, 10:00 AM – 11:00 AM Singapore Standard Time Singapore Time
WEBINAR SERIES: SOLVE HEAT TRANSFER CHALLENGES IN ELECTRONIC BOX, THE SMART WAY!
Modern electronic devices always have the requirement of avoiding overheat to achieve optimum performance. Solving heat transfer issue effectively in electronic devices is important to assure your products are competitive in the market. Investment in multiple prototyping can be costly and experiences are required to solve heat transfer challenges in the industries.
SOLIDWORKS Flow simulation offers the solution to solve heat transfer problems by simulating the effects of temperature, heat transfer effectiveness, and ventilation of your product.
In this 1-hour session, we will simulate a case study of an electronic box utilizing the extensive material database offered by SOLIDWORKS Flow Simulation. You will have the opportunity to compare traditional approach in thermal management and modern simulation approach.
Webinar highlights include:
- How do we determine types of heatsink and the correct sizing
- An insight of heat transfer mechanism
- Extensive material database for electronics component
- Thermal management with the most cost effective and smart approach
FOR MORE INFORMATION
Contact Marketing at 6747 0502
9:45am : Roll-call of Attendees
10:00am : Getting to know ATE
10:05am : Overview and Terminologies
10:10am : Webinar proper
10:50pm : Q&A
: Information Drive (Social Media, Product launch and other information)
11:00am : End of Session
WHO SHOULD ATTEND:
Engineering Analysts, Product Engineers, Simulation Engineers, Middle Management and other Engineers who wants to learn about SOLIDWORKS Simulation and how ATE will value add in meeting engineering challenges.