MIMOS High Value Semiconductor Technology Seminar

MIMOS Berhad

In this seminar, you will be able to gain firsthand experience on the power of Ansys CAE Solution: Paving the Way for Future Semiconductor

We are pleased to invite you to the MIMOS High Value Semiconductor Technology (HVST) Seminar with the theme on Advanced Packaging technology. In this workshop, you will be able to gain firsthand experience on the power of Ansys CAE Solution: Paving the Way for Future Semiconductor Technology Advancements. This complimentary event features engineering experts and thought leaders from related industries sharing best practices in creating breakthrough products and processes.Successful application of product and process simulation (Computer Aided Engineering - CAE) technologies in advanced packaging, semiconductors and advanced electronics will be shared.Learn about the latest CAE simulation tools for trending product development and packaging technologies, including workflows for solving complex multi-disciplinary design and engineering problems in the industry. This an opportunity you cannot afford to miss! Space is limited! Register today!

Agenda

Registration & Welcome Speech

MIMOS - Introduction and Overview

Introducing CAD-IT

David is the Asia Regional Sales Director for New and Emerging Technologies at Ansys. He has been with Ansys for over 23 years and all his tenure has been spent working across Asia. He has held various management and leadership positions within the company. With an aggressive growth strategy, driven by launching new products, through acquisitions and strategic partnerships, David is currently responsible for bringing these new software solutions to market across Asia. David was born and educated in the UK. He holds both a masters degree and a doctorate degree in Chemical Engineering from the University of Leeds. He also holds an MBA in Information and Strategy from EDHEC in France. David started his working career as a Chemical Engineer with Showa Denko, one of Japan’s leading chemical and materials companies. It was within Showa Denko that David was exposed to the power of engineering simulation.

Applications in Semiconductors Advanced Packaging

Naveen Prasad is currently a Senior engineer at CAD-IT Consultants (Malaysia) Sdn Bhd, and has a Bachelor of Engineering (Honors) degree in Electrical and Electronics Engineering from Northumbria University Newcastle. His industry background is in the area of front-end PCB manufacturing. He has previously worked as a PCB CAM engineer, DFM support engineer and Layout design engineer in companies such as Flextronics and Kontron. In CAD-IT he currently supports and trains customers on EM/SI/PI simulation for high frequency antennas, PCBs and packages.

Advanced Interconnect SI/PI Modeling

Lunch & Prayer Break (Sponsored)

Dr. Noor Amalina Ramli is an Application Engineer at CAD-IT Consultant (M), responsible for technical support and pre/post-sales of Ansys software. She has a Bachelor of Engineering in Communication Engineering and a Ph.D. in microelectronics design and fabrication. Noor Amalina has published 13 research papers in areas such as MEMS devices, stretchable sensors, and antennas.

ANSYS Modeling for Next Generation Flexible   Electronics

Dr. Imaan Izhan is an Application Engineer at CAD-IT Consultants and Ansys Certified Professional in technical for Ansys Structures products. Currently he supports the structural mechanics range of Ansys engineering simulation solutions, for CAD-IT's customer across the ASEAN region. He holds a PhD in Mechanical Engineering, where his research was mainly focused in modal testing, structural dynamics and dynamic substructuring. Dr Imaan involved in finite element modeling and analysis since 2014. Mohd Noor Hariz Mohd Hilmin is the application engineer at CAD-IT Malaysia, specializing in computational fluid dynamics (CFD) applications. His main responsibilities in CAD-IT Malaysia includes pre-sales as well as post-sales activities such as providing technical support, project consultancy, conduct workshop and trainings. Hariz had prior experience in the automotive industry being involved on overseeing production line, monitoring operation and quality rate, as well as troubleshooting

Improving Reliability Through Electronics Cooling

Tea Break (Sponsored)

Nazirah is an independent researcher and engineer with experience in optical sensors and instrumentation, particularly in simulation, fabrication, experiment, and testing. She holds a degree in Physics, as well as an MPhil and PhD in Electronics Systems Engineering, specializing in optics from Universiti Teknologi Malaysia. She has collaborated with the Science and Technology Research Institute of Defense, Ministry of Defense Malaysia, in simulating the naval ship hull for underwater electrical potential and corrosion protection studies. In January 2023, she joined CAD-IT Consultants (M) Sdn Bhd, where she specializes in Ansys Optics and Photonics. Her recent consulting projects involved simulating smartphone camera lenses, LIDAR, optical transceivers, projectors, metalenses, monocular riflescopes, bioculars, and binocular devices for prospective customers.

Advancing Optoelectronics Packaging Solutions   with ANSYS Photonics and Optic

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